GYEON Q2M Compound+ (120 ml) High cutting polishing paste

Gyeon Q2M Compound Plus - is a state-of-the-art high cut polishing compound that provides great performance and high scratch removal. It is perfect for polishing hard or ceramic varnishes. Removes P1500 grit paper.

Q2M Compound Plus is water-based and contains high quality Japanese abrasives to remove large scratches easily and quickly. The absence of silicone and fillers greatly accelerates and facilitates the process of preparing the lacquer surface for the next steps.

Works perfectly with polishing furs, hard polishing pads and microfiber pads.

Designed for use with rotary and Dual Action machines.

Cut:

6+/6

Gloss:

4/6